Summary and Info
This book describes innovative techniques to address the testing needs of 3D stacked integrated circuits (ICs) that utilize through-silicon-vias (TSVs) as vertical interconnects. The authors identify the key challenges facing 3D IC testing and present results that have emerged from cutting-edge research in this domain. Coverage includes topics ranging from die-level wrappers, self-test circuits, and TSV probing to test-architecture design, test scheduling, and optimization. Readers will benefit from an in-depth look at test-technology solutions that are needed to make 3D ICs a reality and commercially viable.
More About the Author
Brandon Novak (born December 10, 1978) is a professional skateboarder, actor, stuntman, and friend of Bam Margera and is a prominent member of the CKY Crew.
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Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs 0 out of 5 stars based on 0 ratings.